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Plasma deposition equipment - List of Manufacturers, Suppliers, Companies and Products

Plasma deposition equipment Product List

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ECR plasma deposition device "AFTEX-6000 series"

ECR plasma deposition device "AFTEX-6000 series"

Multi-material multilayer films can be formed! A film deposition device capable of high-quality, high-crystallinity thin film formation.

The "AFTEX-6000 series" forms high-quality thin films at low temperatures and with low damage by directly reacting low-pressure, high-density ECR plasma flows with sputtered particles. Equipped with two ECR plasma sources, it enables fully automated transport and film formation, making it ideal for multilayer film formation. 【Features】 ■ Multilayer film formation with a wide range of film types ■ High refractive index control ■ High-speed film formation ■ High quality and high crystallinity at low temperatures and low damage ■ Cleaning effect on substrates and growth surfaces *For more details, please refer to the catalog or feel free to contact us.

  • Other semiconductor manufacturing equipment

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Plasma deposition device "KOBUS F.A.S.T.(R)"

Plasma deposition device "KOBUS F.A.S.T.(R)"

Utilizing pulse functionality! It is possible to produce thin films equivalent to ALD in the same processing time as conventional CVD.

"KOBUS F.A.S.T.(R)" is a plasma deposition device for industrial ALD-level film quality. By utilizing a pulse function, it is possible to produce films equivalent to ALD (Atomic Layer Deposition) in the same processing time as conventional CVD. The process temperature ranges from 80°C to 500°C, with wafer sizes of 150mm and 200mm, and a deposition rate of 0.1nm/min to 500nm/min. 【Specifications】 ■ Process temperature: 80°C to 500°C ■ Wafer sizes: 150mm, 200mm ■ Deposition rate: 0.1nm/min to 500nm/min ■ Aspect ratio ・20:1 * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.

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Solid Source ECR Plasma Deposition Device "AFTEX-9000 Series"

Solid Source ECR Plasma Deposition Device "AFTEX-9000 Series"

Low-temperature process, high refractive index control, high-speed reactive film formation, dense and flat film.

The "AFTEX-9000 series" is a device capable of achieving high-quality nano thin film formation at low temperatures and with low damage. It supports substrate sizes of up to 8 inches and can accommodate up to three ECR plasma sources, significantly improving productivity by operating them simultaneously. Please use our equipment for nano thin film formation. 【Features】 ■ A fully automated C to C single wafer system with a multi-chamber design that can connect up to three ECR deposition modules for 8-inch substrates. ■ Achieves high productivity with simultaneous deposition using three ECR plasmas. ■ Allows for the setting of transport flow, deposition chamber, and deposition process through recipes, enabling fully automated deposition of multilayer films with any material. ■ Excellent uniformity is achieved through substrate tilt rotation and low-pressure deposition. ■ An in-device spectroscopic system (optional) enables measurement of film thickness, refractive index dispersion, etc. ■ Directly reacts raw material particles from solid sources with a highly active ECR plasma flow, eliminating the need for expensive exhaust treatment equipment and being environmentally friendly. *For more details, please refer to the catalog or feel free to contact us.

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Solid Source ECR Plasma Deposition Device "AFTEX-2300"

Solid Source ECR Plasma Deposition Device "AFTEX-2300"

It is possible to obtain highly crystalline thin films at low temperatures! A cost-effective plasma deposition device.

The "AFTEX-2300" is a high-performance solid source ECR plasma deposition system equipped with a microwave branch-coupled ECR ion source, a load-lock mechanism, and a turbo molecular pump, all at a low price. Thin films grow under the irradiation of high-density ions controlled at low energies of 10-30 eV, resulting in dense, high-quality thin films with atomic-level smoothness. Thanks to the ion assist effect, it is possible to form compound thin films such as oxide and nitride films without high-temperature heating, and it is also possible to obtain highly crystalline thin films at low temperatures. 【Features】 ■ Equipped only with the basic functions of a solid source ECR plasma deposition system ■ Lower price compared to automatic deposition systems ■ Achieves long-term stable operation ■ Clean deposition environment ■ Various interlock mechanisms adopted *For more details, please refer to the catalog or feel free to contact us.

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Solid Source ECR Plasma Deposition Device "AFTEX-8000 Series"

Solid Source ECR Plasma Deposition Device "AFTEX-8000 Series"

A fully automatic multilayer film forming device that can form multilayer films with excellent uniformity!

The AFTEX-8000 series is a fully automatic multi-layer film formation device that features two ECR plasma sources arranged at an angle in a single film formation chamber, capable of forming high-quality optical thin films and multi-layer films with excellent uniformity on substrates up to 8 inches in diameter. By using a high-activity, high-density ECR (Electron Cyclotron Resonance) plasma source and placing a target in the plasma extraction section, it achieves ECR plasma deposition using a solid source. There is no need to use hazardous gases like those in CVD, eliminating the need for exhaust gas treatment, making it an environmentally friendly film formation technology. 【Features】 ■ High insulation film characteristics ■ Multi-layer films ■ Dense and flat films ■ Low damage ■ Long-term stable operation *For more details, please refer to the catalog or feel free to contact us.

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